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C (programming language)
A general-purpose programming language developed in the 1970s by Dennis Ritchie of AT&T; Bell Labs. Its generality, machine independence, and efficiency have made C popular for many application areas. The Unix operating system is written in C and the close linking of Unix and C have made C the de facto standard language in engineering software development.
C++
An object-oriented programming language developed at AT&T Bell Laboratories during the early 1980s. C++ is a "hybrid" language in which object-oriented features have been grafted onto an existing language (C).
CAE
Computer-Aided Engineering. Traditionally, CAE has been used to describe the electrical design rather than the physical design, although these distinctions have blurred. See CAD.
Calcium scaling
the deposition from water of calcium on a metal surface such as a cooling tube or boiler.
Calendar cycle time
the time (averaged over a number of lots) required to process from start to finish (through probe sort); includes weekends and other nonscheduled time.
Calibration gas
in mass flow devices, the gas that is flowed while the device is being calibrated.
Calibration size
the median size within the monodispersed size distribution that is produced for a deposit of polystyrene latex spheres on a calibration wafer. u
Calibration temperature
in mass flow devices, the ambient temperature at which a device was calibrated. [Contrast with gas temperature and standard temperature.
Calichified
permeated with calcium carbonate.
Calorie (cal)
a standard unit of heat equal to the amount of heat required to raise one gram of water one degree Celsius.
Calorimeter
an instrument capable of making absolute measurements of energy deposition (or absorbed dose) in a material through measurement of its change in temperature and a knowledge of the characteristics of its material construction.
Calorimetry
see differential scanning calorimetry.
CAM system
a large body of software and hardware systems responsible for the overall operation of a factory; for example, WorkStream. (WorkStream is a registered trademark of Consilium, Inc.) Also see computer-aided manufacturing (CAM).
Camber
1: edgewise curvature of a leadframe strip edge in the major plane of the leadframe strip. 2: arching, out of the major plane, of a nominally flat ceramic body. Also see flatness.
Cantilever
a small, sharp measuring stylus capable of measuring forces on a nanonewton scale (for example, spring constant < 20 nN).
Cantilever probes
electrical probes for making contact to bare chips that are constructed with the contact pad at the end of a flexible beam.
Cap
of a ceramic semiconductor package, the top portion, or lid. The cap is attached to the base.
Cap deposition
see passivation.
Capability
1: in communication and control of semiconductor manufacturing equipment, an operation performed by semiconductor manufacturing equipment. This operation is initiated through the communications interface using sequences of SECS-II messages (or scenarios). An example of a capability is the setting and clearing of alarms. 2: in statistical process control, see process capability.
Capability index
a measure of the relationship between the specification limits and the process capability. Also see process capability index.
Capability Maturity Model (CMM)
a software process improvement model developed by the Software Engineering Institute of Carnegie Mellon University to assist in evaluating software development maintenance capabilities.
Capacitance-to-Voltage (CV) plotter
an electronic test system used to measure capacitance as a function of voltage between a conductive field plate insulated from a silicon wafer by a dielectric; for example, aluminum or doped silicon insulated from the wafer by silicon dioxide.
Capacitive load
a load in which the capacitive reactance exceeds the inductive reactance; the load draws a leading current.
Capacity buys
Buying of equipment by the semiconductor industry in order to increase its manufacturing capacity. This is as opposed to technology buys, which are purchases of advanced equipment for purposes of developing next generation technologies and other R&D.
Capture
in equipment exhaust systems, to entrain undesirable elements, such as gases, fumes, vapors, and particles, in the exhaust stream for removal.
Carbon dioxide (CO2)
a dense, colorless gas produced by the combustion and decomposition of organic substances and as a byproduct of many chemical processes.
Carbon monoxide (CO)
a colorless, odorless, flammable, and very toxic gas produced by the incomplete combustion of carbon compounds. It is a byproduct of many chemical processes. An asphyxiant, carbon monoxide reduces the ability of blood to carry oxygen.
Carbon tetrafluoride (CF4)
an inert, colorless, and nonflammable gas used in semiconductor processing as an etchant for a variety of films such as silicon, silicon oxide, and silicon nitride. It also is used in resist stripping and as a source of fluoride ions in plasma processes. This gas is a simple asphyxiant (can cause loss of consciousness because of lack of oxygen in the blood). Also called tetrafluoromethane.
Carcinogen
a chemical that (a) has been evaluated by the International Agency for Research on Cancer (IARC) and found to be a carcinogen or potential carcinogen; (b) is listed as a carcinogen or potential carcinogen in the Annual Report on Carcinogens published by the National Toxicology Program (NTP); or (c) is regulated by the Occupational Health and Safety Administration (OSHA) as a carcinogen.
Carrier
1: an entity capable of carrying electric charge through a solid; for example, mobile holes and condition electrons in semiconductors. Also called charge carrier. Also see majority carrier and minority carrier. 2: slang for wafer carrier.
Carrier area
in 200 mm quartz and high-temperature wafer carriers, the area that includes the angle (in degrees) from the intersection of the horizontal center line of the wafers to the top side members on the right side and on the left side.
Carrier capacity
the number of wafers a wafer carrier can hold.
Carrier concentration
the number of majority carriers per unit volume, expressed in dimensionless units such as percentage, parts per million, or parts per billion. Also see carrier density.
Carrier density
in an extrinsic semiconductor, the number of majority carriers per unit volume, usually given in number/cm3, although the SI unit is number/m3. Also see carrier concentration.
Cascade rinse
a deionized water rinse system in which water flows over the top of a tank.
Case temperature
in the measurement of thermal resistance, the temperature at a specified, accessible reference point on the package in which a semiconductor die is mounted.
CASE tools
computer-aided software engineering (CASE) programs used to understand, simplify, and automate the development methods used throughout the software life cycle, to eliminate data redundancy or conflict, improve productivity and reliability, and to capture reusable functionality in terms of design and code.
Cassette
an open structure that holds one or more substrates.
Cassette centroid
the theoretical center of a stack of wafers in a cassette formed by the pocket center line and the "center" pocket.
Cassette envelope
a rectangular box with vertical sides that completely contains a cassette, even if the cassette is tilted.
Cassette module
in modular equipment, a two-port module in which one port accepts or presents a wafer carrier of wafers (or possibly, in an automated factory, an individual wafer) for intertool transport, and the second port accepts or presents a single wafer within the module for intratool transport.
Cassette stage
in a cassette transfer, a stage on a piece of equipment on which a cassette is placed or from which it is removed, allowing the transfer of the cassette.
Cassette transfer robot
in a cassette transfer, a robot that transfers cassettes.
Castellation
on a ceramic chip carrier, that series of ribs and metallized indentations that defines edge-contact regions.
Cataract
an abnormal progressive condition of the lens of the eye characterized by loss of transparency.
Cation
an ion that has a positive charge.
Cation-exchange resin
an ion-exchange resin capable of the reversible exchange of positively charged ions.
Cause-and-effect diagram
a tool for individual or group problem-solving that uses a graphic description of the various process elements to analyze potential sources of process variation.
Caustic
describes a substance capable of destroying or eroding by chemical action.
Cavity
1: in a cofired ceramic semiconductor package, the area that is designated for die attach. The nominal area is defined by the limits of the bond finger ledge (or wire bond cavity). Also see effective die attach area. 2: the overall area for wire bonds in a cofired ceramic package. 3: in a mold for plastic packages, the areas of the mold that become filled with plastic during the molding cycle, encapsulate the die, and form the body of the device. A mold has matching upper and lower cavities, and the term cavity is also used to describe the top or bottom of a finished plastic package. 4: a vacancy or empty space in a wafer. A cavity usually is left by dissolved precipitates or gallium inclusions or by arsenic dissociation, or it may be created by excessive vapor pressure. 5: in pellicle technology, an unfilled space between the photomask and the optically transparent film within the mounted pellicle frame area.
Cavity length
in a semiconductor package, the length of the leadframe area that will contain the die. The cavity is measured from the ends of the lead tips.
Cavity width
in a semiconductor package, the width of the leadframe area that will contain the die. The cavity is measured from the ends of the lead tips. Also see leadframe.
Cavity-down packages
in cofired ceramic packages, packages on which the die surface faces the mounting board.
Cavity-to-frame offset
see offset.
Cavity-up packages
in cofired ceramic packages, packages on which the die surface faces away from the mounting board.
C-chart
an attributes chart used to track the number of nonconformities with a constant sample size. For example, a C-chart can be used to track the total number of particles per wafer, assuming the underlying particle distribution is a Poisson distribution.
CD
see critical dimension.
CdsSPICE
Cadence Design System's version of the popular circuit simulator, SPICE. See SLICE and SPICE.
Ceiling
in safety threshold limit values, the concentration that should not be exceeded during any part of the working exposure.
Cell
1: a group of resources treated as a single entity that accepts a combination of materials and instructions to add value through a series of operations; may be either automated or manual. 2: in circuit design, a circuit required to implement a repeated function on an integrated circuit, such as a bit in a memory chip. 3: in the dot matrix code marking of silicon wafers, the area of a dot matrix within which a dot may be placed to indicate a binary value.
Cell center point
in the dot matrix code marking of silicon wafers, the point in an array at which the center line of a row intersects the center line of a column.
Cell controller
a computer system that supports the people in a cell or bay by partially or fully automating scheduling, material movement, information collection and update, recipe management, and process control.
Cell spacing
in the dot matrix code marking of silicon wafers, the (equal) vertical or horizontal distance between the cell center points of contiguous cells in a square array.
Cell structure
on a semiconductor wafer or substrate, malformations attributable to crystal nonhomogeneities that have their origins in the crystal growth process. Also called block structure.
Center line
in the dot matrix code marking of silicon wafers, the line positioned parallel to, and spaced equally between, the boundary lines of a row or column.
Center-to-center
see pitch.
Central area
in the dot matrix code marking of silicon wafers, the area of a cell enclosed by a circle centered at the cell center point. The central area is used by code readers to sense the binary value of the cell.
Central line
on a control chart, the line that represents the average or median value of the items being plotted.
Central nervous system effects
physical symptoms such as headache, tremors, drowsiness, convulsions, hypnosis, anesthesia, nervousness, irritability, narcosis, dizziness, fatigue, lethargy, peripheral memopathy, memory loss, impaired concentration, restlessness, and sleep disturbance.
Central Utility Building (CUB)
a remote structure housing all chillers, boilers, pumps, air compressors, vacuum systems, and the central facility control center.
Centrality
the placement of an array with the center functional pattern of the array positioned from and referenced to the edge of the photoplate to a specified tolerance.
Ceramic (cer)
a high-temperature material used in forming substrates for packaging integrated circuits. This material is inorganic, nonmetallic, and crystalline. Examples are alumina and beryllia.
Ceramic Chip Carrier (CCC)
a small-footprint, cofired ceramic package, usually with terminals on all four sides. Ceramic chip carriers may be leaded or leadless. Also see chip carrier.
Cerdip
abbreviation for ceramic dual inline package.
Cerpack
abbreviation for ceramic package.
CGA connection cap or plug
a cap or plug fitting over or into, respectively, the threads of a Compressed Gas Association (CGA) connection to seal the connection from leakage and contamination in or out.
Change order
a formal change in drawings and specifications. Also called engineering change order.
Channel
see bin.
Channeled array
A gate array base die with basic cells arranged in rows or columns. This arrangement permits routing in the spaces (channels) between rows of gates. Routing efficiency is usually high, near 90% or more. Routing is generally achieved by placing macros along single rows or columns. TGC103, TGC105 and TGC108 are examples of a channeled array.
Channelless array
A gate array base die with basic cells covering the entire core with no row or column spacing. This array is often called a "sea-of-gates" (an LSI Logic, Inc. trademark) and is more difficult to route. Efficiencies are often 35% or less, due to complexity of the routing process. The advantage to this architecture is that macros can be placed in blocks, which increases macro performance. Larger TGC100 family members are channelless, and smaller members may be redesigned using this architecture.
Character
1: a symbol, letter, digit, or mark used to represent, control, or organize information. 2: a byte sent on a SECS-I serial line. NOTE-Data is transmitted or received in a serial bit stream of 10 bits per character at one of the specified data rates. The standard character has one start bit (0), eight data bits, and one stop bit (1).
Character code
see code element set.
Character misalignment
see adjacent character misalignments.
Character separation
in the serial alphanumeric marking of silicon wafers, the horizontal distance between the adjacent boundaries of any characters.
Character set
1: a finite collection of letters, digits, and other symbols defined for a specific application, such as a programming language, a printer, or an optical scanner. 2: in the bar code marking of silicon wafers, the complete range of characters available for encoding in a particular bar code symbology.
Character spacing
in the serial alphanumeric marking of silicon wafers, the horizontal distance between the character center lines of adjacent characters.
Character window
in the serial alphanumeric marking of silicon wafers, the rectangular area within which all characters must be contained.
Characterization
the use of mathematical modeling, design of experiments, or statistical data evaluation to describe the characteristics of a process, environment, or product.
Characterization node
A characterization node is a characterization parameter which impacts reliability and is measured during initial process or product characterization and at infrequent intervals, thereafter. See characterization parameter, critical node, and performance node.
Characterization parameter
A characterization parameter is a measurement taken on a process, tool, or product during a process or product characterization and at infrequent intervals thereafter. See characterization node.
Characterize
to describe the quality of.
Charge carrier
see carrier.
Chase
a support equipment area between bays in a wafer fabrication facility in which the chemicals, power, air, and other facility items that support the operation of the bays are placed. The chase usually is not as clean as the bays.
Check character
in the bar code marking of silicon wafers, a character included within a symbol, the value of which is used to perform a mathematical check to ensure the accuracy of the read.
Check valve
a flow-controlling device, installed in a tube or pipeline, that allows flow to occur in only one direction and positively prevents flow in the opposite direction.
Checksum
in message transfer, a 16-bit number used by the receiver to detect transmission errors. NOTE-A checksum is calculated as the numeric sum of the unsigned binary values of all the bytes after the length byte and before the checksum in a single block.
Chemical amplification
used in photolithography to describe a process in which process exposure sensitivity of a photoresist is enhanced through secondary chemical reactions that are triggered by a primary photochemical reaction. Also see chemically amplified resist.
Chemical etch
the dissolution of the material of a surface by subjection to the corrosive action of a liquid or gaseous acid or an alkali.
Chemical milling
the gross removal of material from a body by the corrosive action of an acid or an alkali that results in a substantial change of shape of the body.
Chemical reversal
a develop operation on a resist image that reverses the polarity of the image.
Chemical Vapor Deposition (CVD)
in semiconductor technology, a process in which a controlled chemical reaction produces a thin surface film. Contrast physical vapor deposition.
Chemically amplified resist
a type of photoresist, typically used in deep ultraviolet (DUV) lithography, that relies on the catalytic action of a photogenerated acid during the post-exposure bake (PEB) process to alter the solubility of the exposed film. Since the acid catalyst is not consumed during PEB reaction, it can participate in multiple reaction cycles, thus providing an amplification mechanism. Also see chemical amplification.
Chemical-Mechanical Polish (CMP)
a process for the removal of surface material from a wafer. The process uses chemical and mechanical actions to achieve a mirror-like surface for subsequent processing. Also called chem-mech polish.
Chemiluminescence
emission of light during a noncombustible chemical reaction.
Chem-mech polish
See chemical-mechanical polish.
Child
in object-oriented programming, a level within the model hierarchy descended from the preceding parent level. Also see inheritance.
Chill plate
a process module used to cool wafers after a bake process.
Chip
1: in semiconductor wafers, a region where material has been unintentionally removed from the surface or edge of the wafer. Contrast indent. 2: see die. 3: in packaging, a region of material missing from a component; for example, ceramic from a package or solder from a preform. The region does not progress completely through the component and is formed after the component is manufactured. The chip size is given by its length, width, and depth from a projection of the design plan-form. Also called chip-out. Contrast pit. 4: in flat panel display substrates, a region of material missing from the edge of the glass substrate, which is sometimes caused by breakage or handling.
Chip Carrier (CC)
a small footprint semiconductor package generally with terminals on all four sides. The package may be manufactured by cofired ceramic or multilayer printed circuit board technologies. Also see castellation and ceramic chip carrier.
Chip-level integration
The combination of two or more integrated-circuit functions and/or technologies on one IC to achieve miniaturization, reduce systems cost, and make new applications possible. Particularly important for signal processing and power control solutions.
Chip-On-Board (COB)
a configuration in which a die is placed directly onto a substrate. Approaches include wire bonding, tape automated bonding, and solder interconnections.
Chip-out
see chip.
Chlorine (Cl)
an element; gaseous chlorine (Cl2) is greenish-yellow, approximately 2.5 times as heavy as air, and has a disagreeable and suffocating odor. Chlorine is used as a gas etchant for semiconductor materials, specifically for aluminum etching, especially in conjunction with boron trichloride.
Chromatography
1: a method of separating and analyzing mixtures of chemicals. 2: the separation, especially of closely related compounds, by allowing a solution or mixture to seep through an adsorbent (such as clay, gel, or paper) so each compound becomes adsorbed into a separate, often colored, layer.
Chuck mark
any physical mark on either surface of a wafer caused by a robot end effector, a chuck, or a wand.
CIM
see computer-integrated manufacturing.
Circuit
the combination of a number of connected electrical elements or parts to accomplish a desired function.
Circuit design
techniques used to connect active (transistors) and passive (resistors, capacitors, and inductors) elements in a manner to perform a function (that is, logic, analog).
Circuit geometries
the relative shapes and sizes of features on a die.
Circuit simulation
An accurate means of verifying the behavior of a circuit before it is fabricated. Very accurate models of the circuit devices--such as transistors, resistors, and capacitors--are used in a simulator that applies efficient numerical analysis algorithms to solve fundamental circuit analysis equations.
CISC
Complex Instruction Set Computer
Clamped condition
the fixing of a semiconductor wafer to a chuck as by vacuum.
Class
1: a set of objects that share a common behavior. The terms class and type are usually (but not always) interchangeable; a class is a slightly different concept, in that it emphasizes the importance of hierarchies. 2: defines the methods, messages, and properties of a similar group of objects (the objects are instances of the class). Classes themselves may be objects. 3: a template for defining the methods and variables for a particular type of object. All objects of a given class are identical in form and behavior but contain different data in their variables.
Class 'B'
A screening process for circuits that are intended for use in ground-based military electronic systems. Must conform with screening standards per MIL-std 883-C and MIL-M-38510. Compare Class 'S'.
Class hierarchy
defines the inheritance scheme for a collection of classes. a
Class library
a collection of object-oriented programming system (OOP) classes and methods belonging to a specific domain. For example, a graphics library may exist consisting of classes of graphical objects.
Class 'S'
A screening process for circuits that are intended for use in satellite systems for military space applications. Must conform with screening standards per MIL-std 883-C and MIL-M-38510. Compare Class 'B'.
Clean
an operation that removes contaminants, particles, or resists from the surface of a substrate.
Cleanroom
a confined area in which the humidity, temperature, particulate matter, and contamination are precisely controlled within specified parameters. The class of the cleanroom defines the maximum number of particles of 0.5-micrometer size or larger that may exist in one cubic foot of air in the designated area. For example, a class 1 cleanroom allows one such particle of any kind to exist in one cubic foot of space; a class 10 area may contain no more than 10 such particles in one cubic foot of space.
Cleanroom Interface Chamber (CIC)
a load lock through which wafers are transferred to or from the cleanroom environment, wafer carriers, or transport systems that supply the process equipment. No wafer processing is performed within the CIC.
Clearance
the minimum distance between the edges of sequentially applied images.
Cleavage plane
1: a crystal plane along which the material fractures smoothly when scribed or struck. 2: a crystallographically preferred fracture plane.
Client
an object that uses the functionality defined by another object (the server) to implement a certain portion of its own functionality. In this sense, a client delegates responsibility to the server.
Clock
a function that provides timestamping of event reports and alarm messages. The clock allows the equipment to be instructed by the host to set an internal clock to a time value specified by the host. The equipment can request the current date and time.
Clock frequency
the master frequency of the periodic pulses that synchronize operations of a logic circuit.
Closed architecture
A system whose characteristics are proprietary and therefore cannot be readily connected with other systems. Compare open architecture.
Closed secondary containment
secondary containment that has a sealed annulus. In closed containment systems, the annular space either holds a certain pressure of gas or a certain level of vacuum. In closed containments a change in the pressure or vacuum would indicate a leak in either the primary or secondary system.
Closure error
see cumulative pitch error.
Cloud
see haze.
Cluster controller
1: the processor, I/O subsystem, and software that controls the overall operation of an integrated manufacturing tool (cluster tool), including material sequencing, recipe and alarm handling, and other information-handling functions. 2: the virtual semiconductor device responsible for control of an entire cluster tool.
Cluster module
an element of a tool that has well-defined functions and interfaces. It may contain other modules and may be either hardware or software.
Cluster tool
an integrated, environmentally isolated manufacturing system consisting of process, transport, and cassette modules mechanically linked together. The modules may or may not come from the same supplier.
Cluster tool recipe
a set of instructions for the processing of wafers through a sequence of integrated process modules (cluster tool); includes a sequence of process-module "visits" with a corresponding process-program reference.
CLY
Circuit Limited Yield. See yield.
CMOS
see complementary metal oxide semiconductor.
CMOS2, CMOS3, CMOS3.5
A family of CMOS processes. These processes are used to support a wide range of digital applications, including microprocessors, logic, automotive and semicustom. All of the processes use junction isolation and local oxidation (LOCOS) to separate individual devices within a circuit. Their gate length is 3m, 2m and 1.5m respectively.
CMP
see chemical-mechanical polish.
Coat
1: to cover a substrate surface with a layer of a material by the spinning of a resist. n 2: the cover applied by the spinning of a resist. 3: a step in the resist-apply operation in which a uniform film is applied to the entire face of a wafer.
Coater
equipment used to spin resist onto wafers. Also calledspinner and whirler.
Coaxial cable
an electrical transmission line that consists of a central inner conductor surrounded by a tubular outer conductor. Both conductors are separated and supported by an electrically insulating medium.
COB
Chip-On-Board. One of many configurations in which a chip is directly bonded to a circuit board or substrate. These approaches include wire bonding, TAB, or flip-chip interconnections. See wire bonding, TAB, flip-chip.
Code
an established convention that assigns elements of one character set to the elements of another set. Also see coded set and code element set.
Code element set
characters or character strings assigned to represent one or more individual characters or character strings of another group; for example, abbreviations, ASCII, or instruction code. Also called character code.
Coded set
the character elements represented by a code element set.
Coefficient of Thermal Expansion (CTE)
the increase in length or volume of a solid, liquid, or gas for a rise of 1 degree C at constant pressure. This coefficient is used, along with the glass transition temperature, to determine the expansion characteristics of molding compounds used in the manufacture of semiconductor packages. Usually, the linear coefficient is used for packaging considerations.
Cofired
in the manufacture of some types of ceramic packages, the technology used to join together various ceramic layers and metallization patterns screen printed onto those layers by simultaneous firing at high temperature.
Coherence
1: a property of electromagnetic waves that have a definite phase relationship to each other. 2: a measure of the ability a source of electromagnetic radiation has to interfere.
Coil set
longitudinal bowing of the leadframe strip caused by the set taken by the strip. Longitudinal bowing occurs due to storage of the raw copper strip in continuous coil form prior to cutting the strip to length for leadframes. [ontrast crossbow. Also see package.
Coined area
the area at the tip of internal leads (bond fingers), which is flattened by a punch to produce an area suitable for wire bonding. The flattened area is defined by length and width (or as a minimum percentage of the bond finger area) and depth.
Cold wall reactor
A machine (usually a CVD machine) in which the wafers are heated directly rather than through the walls like in a furnace. This can be done by shining a light on the wafers, exposing them to electromagnetic energy, or mounting them on heated plates. The walls of the reactor are then at a lower temperature than the wafers.
Collection event
1: in communications and control of semiconductor manufacturing equipment, an event or grouping of related events on the equipment that is considered to be significant to the host. 2: in equipment communications, an event that may be used to initiate the collection and reporting of data. A collection event may trigger an event report. A collection event may also start or stop one or more trace reports.
Collector
One of the three regions that form a bipolar transistor. The base-collector P-N junction is usually reverse-biased so that minority carriers that are injected into the base from the emitter are efficiently extracted into the collector. See also base, bipolar transistor and emitter.
Collimator
1: a device of radiation-absorbent material intended for defining the direction and angular divergence of the radiation beam. 2: a piece of hardware placed between the sputtering cathode and the wafer during physical vapor deposition that filters out low-angled sputtered material and thus enhances step coverage into contacts and vias on the wafer surface.
Collinear four-probe array
see four-point probe.
Column
the set of functional patterns lying along a Y-Y axis of a photomask.
Combustible
easily ignitable and free-burning.
Combustible liquid
a liquid that is capable of burning and has a flash point greater than 37.8 degrees C (100 degrees F).
Comet
on a substrate, a buildup of resist shaped like a comet and generated by a defect. Also called motorboat.
COMETS
see WorkStream.
COMFET
See IGBT.
Command
an input that requires performance of a specific function by a computer program or operating system.
Committed
a method used in file systems and database management systems to ensure integrity. Data changes are made in a nonpermanent way until a complete logical transaction is completed. The changes are then made permanent as a group, or "committed." If there is a problem, all changes in the logical transaction are deleted or "rolled back."
Common cause
a source of variation that affects all the individual values of the process output being studied; in control-chart analysis, it appears as part of the random process variation. Contrast special cause.
Communicating
in SECS communications, describes one of the two substates under the enabled state. In the communicating state, SECS communication with a host computer must be upheld. Also see disabled.
Communication failure
in communications and control of semiconductor manufacturing equipment, a condition that occurs when an established communications link is broken. In a SECS-I environment, this occurs when the protocol retry limit (RTY) is exceeded.
Communication fault
in communications and control of semiconductor manufacturing equipment, a condition that occurs when the equipment does not receive an expected message, or when either a transaction timer or a conversation timer expires.
Communications
the sending and receiving of information between two devices.
Comparator
A device that compares two inputs for equality. One type compares voltages and gives one of two outputs--less than or greater than. Another type compares binary numbers and has three outputs--less than, equal to, or greater than. A third type compares phase or frequency and gives an analog output voltage depending on the relationship between the inputs.
Compatibility
the ability of one machine, such as a computer, to handle programs and data designed for a different machine type or model; the ability of two or more systems to exchange information. Contrast interoperabilty.
Compensation
1: in an extrinsic semiconductor, reduction in the number of free carriers resulting from the presence of impurities other than the majority dopant density impurity. 2: in packaging, changes made to the nominal dimensions in order to design master artwork for a leadframe to be produced by etching. The changes compensate for process characteristics, such as etch factor or undercut.
Compensation doping
addition of donor impurities to a p-type semiconductor or of acceptor impurities to an n-type semiconductor.
Compiler
(1) A software tool used to translate higher-level languages (e.g., C, FORTRAN, COBOL) into machine code, or, (2) A software tool used to translate specifications of circuit functions (e.g., RAM, ROM, ALU, controller) into schematics and layouts.
Complementary
A term describing integrated circuits that employ components of both polarity types connected in such a way that operation of either is complemented. A complementary bipolar circuit would employ both NPN and PNP transistors, and a complementary MOS circuit (CMOS) would employ both N-channel and P-channel devices. In general, complementary devices operate with opposite polarity voltages and currents--advantageous in many circuit applications.
Complementary Metal Oxide Semiconductor (CMOS)
a fabrication process that incorporates p-channel and n-channel MOS transistors within the same silicon substrate.
Component
1: an individual electronic part, such as a device, diode, or capacitor that is fabricated in a metal oxide semiconductor or bipolar process. 2: an individual piece or a complete assembly of individual pieces, including industrial products that are manufactured as independent units, capable of being joined with other pieces or components. The typical components referred to by the specification are valves, fittings, regulators, gauges, instrument sensors, a single length of tubing, several pieces of tubing welded together, tubing welded to fittings, and the like. 3: the fundamental parts of an object, its entities, or relationships. 4: the hardware and software that work in sets (functional entities) to perform the operation(s).
Component object
in equipment communications, an object that is part of an aggregation. Also see aggregation object.
Composite cell
an arrangement of several basic cells.
Composite drawing
a large-scale drawing that comprises all geometric forms, arranged in their proper relative positions, required for a single device. Also called composite pattern, design drawing, engineering drawing, layout, and master drawing.
Compound transfer
in automated material movement, a combination of two or more atomic transfers executed sequentially or concurrently to achieve a single goal, such as exchanging carriers or moving a carrier between process machines using a transfer agent.
Compressed gas
a gas or mixture of gases in a closed container having an absolute pressure exceeding 40 psi at 70 degrees F.
Computer-Aided Design (CAD)
1: the process of designing a part or assembly using a computer system to capture the designer's intent, produce drawings, and analyze the behavior of the object. 2: the area of data processing concerned with the design, supply, operation, and support of systems performing such functions.
Computer-Aided Manufacturing (CAM)
the use of a computer to collect data from a process automatically or to control the operation of a machine.
Computer-Aided Systems Engineering (CASE)
the application of computers to the creation, testing, and modification of software.
Computer-assisted training
an instructional or presentation program that is delivered by way of the computer; however, it may not have the high interaction and branching capabilities of a computer-based training program. Also see computer-based training.
Computer-Based Training (CBT)
a highly interactive instruction course designed and developed on a computer for delivery as a computer-based learning program. Some CBT programs may incorporate onboard user registration and evaluation as well as audio, video, and simulation capabilities.
Computer-Integrated Manufacturing (CIM)
1: the integration of computer control and monitoring into a process of manufacturing. 2: The integration, through computers, of manufacturing functions with other aspects of a business, such as sales, marketing, and product engineering.
Computer-Integrated Manufacturing Impact Model (C(IM)2)
a spreadsheet model developed by SEMATECH. C(IM)2 can be used to estimate the financial impact of CIM applications on semiconductor fabs.
COMSEC
COMmunications SECurity. In semiconductors, refers to devices (generally embedded modules) designed into a host communications system to prevent unauthorized access.
Concentration
the relative amount of a minority constituent of a mixture to the majority constituent (in, for example, parts per million, parts per billion, or percentage) by either volume or weight.
Concentricity
in dielectrically isolated (DI) wafers, the distance between the center point of the DI wafer and the centerpoint of the photolithographic pattern.
Conceptual architecture
in a database, a high-level description of an architecture that describes it basic components, functions, relationships, interactions, and underlying principles.
Conceptual model
1: a global view of the enterprise. 2: a model of entities and their relationships within a database that describes and represents global views.
Conceptual schema
1: in a database, a schema that describes a conceptual model. 2: the complete description of a schema that describes the entities in an enterprise. It documents all of the entities and their behaviors (semantics) but does not consider run-time details such as performance. The conceptual schema integrates the enterprise by describing-from a global perspective-its relationships and constraints, independent of any single use.
Conchoidal fracture
a fracture having smooth convexities and concavities like a clamshell. Also see chip.
Concurrent design or engineering
a style of design in which different phases of the design process are executed simultaneously. (The alternative is sequential design, in which one phase of the design must be completed before the next phase can begin.) [1994 National Technology Roadmap for Semiconductors ]
Condensation Nucleus Counter (CNC)
a light-scattering instrument that detects particles in a gaseous stream by condensing supersaturated vapor on the particles.
Conductivity type
of a semiconductor crystal or wafer, a property that identifies the majority charge carrier in the semiconductor. The two types of materials are n-type and p-type. The majority current carriers in n-type material are electrons. The majority current carriers in p-type material are holes.
Conductivity, electrical
a measure of the ease with which charge carriers flow in a material; the reciprocal of resistivity.
Conductor
a substance through which electricity can readily flow. Contrast insulator.
Confidence Interval (CI)
upper and lower bounds around an expected value that will, within a certain percentage of confidence, include the expected value.
Configuration
the definition of equipment and interfaces necessary for a given application.
Confocal
refers to a microscope design with superior abilities to image submicron features on a wafer.
Conform
to be similar in form and character and to behave in accordance with prevailing modes or customs.
Conformal coating
thin, nonconductive film applied to a circuit for environmental or mechanical protection; usually plastic or inorganic.
Conjugate bridge
the detector circuit and the supply circuit are interchanged as compared with a normal bridge of the given type. [IEEE]
Connected tubs
in dielectrically isolated (DI) wafers, adjacent tubs that are not completely surrounded by an oxide but are connected by silicon.
Connections
the physical links to net interconnecting logic units on a given package level, including connections to terminals at that level, that provide connection to the next-higher package level.
Connectivity
the capability of forming an operative data link between two units.
Consortium
A combination or group of organizations formed to undertake a common objective that is beyond the resources or capabilities of any single organization. Plural: consortia.
Constant temperature oven
in the seal testing of fluorocarbon tube fittings, a hot-air oven used to condition the specimens to the specified temperature.
Constructs
1: categories of information used to define something. 2: the language from which a model is created and specified.
Contact
in an oxide layer, an opening that allows electrical connection between metal and silicon layers. Also see window and via.
Contact pad
1: in a leadless chip carrier or land grid array package, the metallized areas on the bottom of the package that provide contact points between the internal metal traces and connecting external circuitry. They are also used as electrical test pads. 2: in packages with brazed leads or pins, such as leaded chip carriers, pin grid arrays and sidebrazed dual inline packages, the pads to which the leads are brazed. Also see ceramic chip carrier and pin grid array.
Container
a protective transport device for a cassette. Also called box.
Container centroid
as specified by the container manufacturer; in the absence of any such specification, the location of the cassette centroid within the container.
Container envelope
a rectangular box with vertical sides that completely contains a container even if the container is tilted.
Contaminant
1: an unwanted substance present in the cleanroom or on the product. Also see dirt and particulate. 2: in gallium arsenide technology, surface feature that cannot be removed by the preinspection (nonetching) cleaning.
Contamination
1: the presence of particles, chemicals, and other undesirable substances, such as on or in a process tool, in a process liquid, or in a cleanroom environment. Also see area contamination and particulate contamination. 2: three-dimensional foreign material adhering to a package (plastic or ceramic) or leadframe, or parent material displaced from its normal location and similarly adhered. Adherence means that the particle cannot be removed by an air or nitrogen blast at 20 psi. Also see stain.
Contamination-free manufacturing
integrated circuit processing without adding contaminants that degrade the electrical performance of a finished die.
Continuous code
in the bar code marking of silicon wafers, a bar code symbol in which all spaces within the symbol are parts of characters. There is no intercharacter gap in a continuous code.
Continuous gas-detection system
a gas-detection system in which the analytical instrument is maintained in continuous operation, and sampling is performed on a cyclical basis at a period not to exceed 30 minutes.
Control
in communications and control of semiconductor manufacturing equipment, to exercise directing influence.
Control block
The circuitry that performs the control functions of the CPU. It is responsible for decoding microprogrammed instructions and then generating the internal control signals that perform the operation requested.
Control chart
a graphic representation of a characteristic of a process that shows plotted values of statistical data gathered from that characteristic, a central line, and one or two statistically derived control limits.
Control integration
the degree to which tools have a common mechanism for invocation, communication, and combination.
Control limits
the maximum allowable variation of a process characteristic as a result of common causes alone. Calculated from process data and usually presented as a line (or lines) on a control chart. Not to be confused with engineering specification limits.
Control parameter
A control parameter is a measurement taken for the purpose of controlling an in-line process or as a test on product. See critical node.
Control product
a sample component that gives consistent, stabilized counts at or below the expected counts from the test components. The product is run periodically in accordance with the test protocol to assure that the system is not contributing particles at significantly unexpected levels.
Controlled work area
a space within a building where hazardous production materials may be stored, handled, dispensed, or used.
Convection oven
an electric oven used for baking and removing moisture from wafers. The heat is transferred by air flow, rather than by direct contact or radiation.
Conversation
a sequence of related messages; a series of one or more related transactions used to complete a specific task. A conversation should leave both the originator and the interpreter free of resource commitments at its conclusion.
Conversation timeout
an indication that a conversation (a sequence of related messages) has not completed properly. A conversation timeout is application dependent.
Converter
See A/D converter, D/A converter and DC-DC converter.
Convolver
A circuit element that implements convolution, a mathematical process that is the basis for all filters and fundamental to DSP.
COO
see cost of ownership.
Coordinate system origin
in flat panel display, the origin from which dimensions and coordinates are measured.
Coplanarity
1: in a leadframe, the total indicator reading (TIR) of the position of all the tips of the bonding fingers in the Z direction. 2: of a surface mounted package, the deviation of the tips of the package terminals from the seating plane. Also called planarity.
Coprocessor
a processing unit that performs specific functions delegated by the main processor in a computer system. Examples are the graphics coprocessor and the floating point coprocessor.
Core
1: a region of a crystal that has different characteristics from the rest of the crystal, usually higher dopant density. 2: on a polished monocrystalline gadolinium gallium garnet wafer, a material defect caused by nonplanar growth interface. This defect normally is highly stained and misoriented with respect to the surrounding area.
Core equipment set
a group of individual pieces of equipment that are in close proximity and that perform a commonly used process sequence. Most wafer transport within a core equipment set is automatic.
Corner cut
in flat panel display substrates, the removal of the corners of a substrate either by lapping or by grinding.
Correct reception
see ACK.
Correlation
the degree of linear relationship between two variables. A simple correlation coefficient falls between -1 and 1. A zero indicates no relationship whatsoever.
Corrosion rate
the amount of material removed by a corrosive chemical in unit time at a given temperature, normally expressed in inches per year.
Corrosive
a chemical that, when tested on the intact skin of albino rabbits by the method described in the U.S. Department of Transportation in Appendix A to CFR 49 Part 173, destroys or changes irreversibly the structure of the tissue at the site of contact following an exposure period of four hours. This term does not refer to action on inanimate surfaces.
Cost Of Ownership (COO)
the total lifetime cost associated with acquisition, installation, and operation of fabrication equipment.
Cost/Resource Model (CRM)a factory-level model developed by SEMATECH that can estimate total fab, assembly, and test costs. It can model multiple products using multiple
processes. Based on a business plan, it performs factory sizing and reports product costs. CRM can perform four types of analyses: step yield modeling, resource planning, product costing, and financial feasibility.
Count standards
for particle contribution testing, samples of particles (available only in polystyrene latex at this time) of certifiable concentration and size distribution.
Counter
1: a device that increases or decreases a number or amount. 2: a location in a computer or other machine where information about accumulative events is stored.
Counting accuracy
a percentage of the total known countable features on a wafer. Counting accuracy is determined by scanning a wafer with a known pattern of individual scattering centers.
Cp
see process capability. (The "p" part of the abbreviation is written with a subscript lowercase letter.)
Cpk
see process capability index. (The "pk" part of the abbreviation is written with subscript lowercase letters.)
CPU
Central Processing Unit. The heart of any computer system. Basically, the CPU is made up of data registers, computational circuits, the control block, and I/O (input /output.) See microprocessor and MPU.
Crack
1: on semiconductor wafers, a cleavage or fracture that extends to the surface and may or may not pass through the entire thickness of the wafer. 2: of a semiconductor package or solder preform, a cleavage or fracture that extends to the surface. The crack may or may not pass through the entire thickness of the package or preform. 3: in flat panel display substrates, a fissure located at the sheet edge or central area.
Cracked bead
in an ion-exchange resin, a bead (of an ion-exchange resin material) that exhibits a visible crack when viewed at 20X magnification.
Crater
on the surface of a slice or wafer, an individually distinguishable bowl-shaped cavity. A crater is visible when viewed under diffused illumination.
Cratering
on a slice or wafer, a surface texture of irregular closed ridges with smooth central regions.
Creep
1: a measurement of the seating action of a regulator, determined by the increase in outlet pressure when flow is decreased from almost zero (0.1% of the maximum rated flow) to zero. 2: the gradual change in dimensions of an object from prolonged exposure to high temperature or stress.
Crescents
structures with parallel major axes, attributed to substrate defects either above or below the surface plane of silicon substrates after epitaxial deposition. Also see fishtails.
Criterion-referenced instruction
a way of organizing and managing instruction in which prespecified performance criteria are achieved by each qualified learner. Also called mastery learning.
Critical area
the area in which the center of a defect must occur to cause a failure or fault. Also see fault and fault probability.
Critical Dimension (CD)
the width of a patterned line or the distance between two lines, monitored to maintain device performance consistency; that dimension of a specified geometry that must be within design tolerances. Also see linewidth.
Critical node
A critical node is a control parameter which impacts the reliability of a circuit on a given technology. See control parameter, characterization node, and performance node.
Critical path
in a project, the longest sequence of interdependent activities. The delay of any critical path activity will cause a corresponding delay in completion of the project.
Critical pressure
the pressure at which a substance may exist as a gas in equilibrium with the liquid at the critical temperature.
Critical seal area
on a semiconductor package, the area bounded by the shortest distance from the largest cavity, usually the wire bond cavity, to the edge of the package or ceramic layer forming the seal area. Contrast noncritical seal area. Also see critical seal path.
Critical seal path
on a semiconductor package, the shortest nominal design distance from the edge of the largest cavity, usually the wire bond cavity, to the edge of the edge of the package or the minimum width of the ceramic layer forming the seal area. Also see critical seal area. Contrast seal area.
Critical temperature
the temperature above which gas cannot be liquefied by pressure alone.
CRM
see cost/resource model.
Cross flow boat
a quartz carrier used to hold wafers at right angles to the flow of gas inside a diffusion furnace.
Cross purge
a configuration of purging manifold that incorporates three valves and an inlet connection for process gas. The three valves are a regulator isolation valve, a high-pressure side vent valve, and a purge gas inlet valve. Internal passage of the intersection piping between components is in a "cross" pattern.
Crossbarthe structure that connects the two sides of a wafer carrier at the bar end of the carrier and is used to align the carrier to processing equipment. Also called a bar or an
H-bar.
Crossbow
the transverse bowing of a leadframe strip. Contrast coil set. Also see package.
Crosscut technologies
in the categorization of technologies, specific technologies that are required by several of the primary technologies identified in the National Technology Roadmap for Semiconductors. For example, metrology is a common need of all the Roadmap's primary technologies required for integrated circuits, thus metrology is a crosscut technology.
Crossover
1: a change from one pumping method to another; for example, from a mechanical to a high-vacuum pump. 2: the point on a die at which a conductor crosses over a second conductor without electrical contact.
Crosstalk
the undesirable addition of one signal to another in a circuit usually caused by coupling through parasitic elements. An example would be inductive or capacitive coupling between adjacent conductors.
Crossunder
on a die, the point at which a conductor crosses under a second conductor without making electrical contact.
Crow's foot
on a semiconductor wafer, intersecting cracks in a pattern resembling a "crow's foot" Y on {111} surfaces and a cross "+" on {100} surfaces. Also see crystallographic notation.
Cryogenic liquid
a liquid with a boiling point at atmospheric pressure below -150 degrees Celsius.
Cryogenic pump
equipment that freezes and absorbs gases to create a very high vacuum.
Cryogenic storage
a procedure that employs an extremely low-temperature tank to maintain process gases in a liquid form.
Crystal
a solid composed of atoms, ions, or molecules arranged in a pattern that is periodic in three dimensions.
Crystal defect
departure from the regular arrangement of atoms in the ideal crystal lattice. Also see damage.
Crystal indices
see Miller indices. Also see crystallographic notation.
Crystal lattice
in a crystal, the three-dimensional and repeating pattern of atoms.
Crystal Originated Particle (COP)
a surface depression that is formed during soft alkaline chemical treatment of silicon wafer surfaces that contain crystal defects at or close to the wafer surface and that scatters light similarly to a very small particle. Also called surface micro defect.
Crystallographic notation
a symbolism based on Miller indices used to label planes and directions in a crystal as follows: (111) plane [111] direction {111} family of planes <111> family of directions
CTE
see coefficient of thermal expansion.
CUB
see central utility building.
Cumulative pitch error
the algebraic sum of pitch errors of a predetermined number of functional patterns. Also called closure error. Also see pitch.
Current
in scanning tunneling microscopy, tunnel current, expressed in nanoamperes (nA), that flows across the tip surface gap.
Custom cell synthesis (CCS)
Similar to symbolic layout and compaction, CCS takes as its symbolic beginning the transistor schematic of the circuit. From there, the layout and compaction are equally dependent on the quality of the algorithm and the layout rules for the minimization of the area taken up by the circuit.
Custom integrated circuit
An integrated circuit that requires a full set of masks specifically designed for a particular function or application. A custom IC is usually developed for a specific customer and may have to withstand harsh environments.
Customer satisfaction index
An objective measure of performance against customer expectations, as monitored through formal interviews with specific customers.
Customizable
pertaining to a program, system, or product constructed to be easily altered to meet the needs of specific users or customers.
Customize
to construct or alter a program, system, or product to meet the needs of specific users or customers.
Cut-back
the removal of a small amount of leadframe metal from a bonding finger to signify pin number 1. The bonding finger may be shorter or shaped differently from the other fingers. Similarly, shaping of a bond finger metallization in cofired packages also indicates pin number 1.
C-V plotter
see capacitance-to-voltage (CV) plotter.
CVD
see chemical vapor deposition.
Cyanogen (CNCN)
a gas formed in some plasma aluminum etchers that combines with the water in the atmosphere to form poisonous hydrogen cyanide (HCN). Its bitter almond odor can be detected at levels below dangerous concentrations. Also see dry plasma etch.
Cyanogen chloride (CNCl)
a poisonous gas formed in some plasma aluminum etchers. Its odor is detectable at the threshold limit value. Also see dry plasma etch.
Cybernetics
the science of communications and control theory that deals with automatic control systems in living organisms and mechanical-electrical communications.
Cycle (equipment)
see equipment cycle.
Cycle life
for valves, a composite of two characteristics: catastrophic valve failure, which is a single value, and degraded performance, which is a plot of test gas leak rate versus cycles.
Cycle time
the length of time required for a wafer to complete a specified process or set of processes. Also see equipment cycle, minimum theoretical cycle time, and theoretical cycle time.
Cycling test
in particle contribution testing, a test performed to determine the effect of valve cycling on valve particle contribution.
Cylinder
a pressure vessel designed for pressures higher than 276 kPa absolute and having a circular cross-section. It does not include a portable tank, multiunit tank, car tank, cargo tank, or tank car.
Cylinder pressure
pressure contained in a gas cylinder prior to regulation.
Cylinder tare weight
containers that are stamped to denote the weight of the container or the weight of the container and the valve less the product. This weight does not include the weight of any protective cylinder cap.
Cylinder valve
a valve specifically designed for use on portable gas cylinders.
Cylinder valve outlet plug
a plug threaded into or over the outlet-port threads of a cylinder valve to seal the port in case of valve leakage and to seal out contamination.
Cylinder valve protective device
a cover or collar that surrounds or protects a cylinder valve from external abuse or damage.
Czochralski (CZ)
The Czochralski or CZ crystal growth technique is the most frequently used method for producing large single crystals of silicon (also germanium or gallium-arsenide). In the CZ method a cylindrical single crystal is pulled vertically from silicon melt in a heated crucible. The growth is initiated by dipping a small seed crystal in the melt, and after the thermal equilibrium is reached, the crystal is pulled upwards so that it grows with a constant diameter. At the same time, the crystal rod and the crucible are rotated in opposite directions. These crystal rods are cut into thin wafers and processed to be used in integrated circuit (IC) manufacturing. See Gallium Arsenide, integrated circuit, silicon.
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