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Machine language
A machine-oriented programming language (as distinguished from a high-level, application-oriented programming language). Since the only language microprocessors can understand is binary, all other programming languages must be translated into binary instruction code before performing the desired instructions.
Macro instruction
an instruction in a source language designated to be replaced by a defined sequence of instructions in the same source language; it may also specify values for parameters in the defined instructions.
Macro level
in automated material movement, the level of material movement that involves coordination by the host but may not require knowledge of the physical process used to accomplish the material transfer.
Macroscopic
large enough to be seen by the unaided eye.
Macroscratch
a scratch that is visible to the unaided eye either under incandescent (high intensity) or fluorescent (diffuse) illumination. Contrast microscratch.
Maintainability, equipment
see equipment maintainability.
Maintenance
the act of sustaining equipment in a condition to perform its intended function.
Major flat
see primary orientation flat.
Majority carrier
a type of charge carrier constituting more than one-half the total charge carrier concentration (for example, holes in p-type material). Contrast minority carrier.
Make-up air
the amount or percentage of fresh air delivered or mixed with recirculating air on a normal cycle of air by volume.
Malais
a feeling of general discomfort, distress, or uneasiness.
Manual override
a mechanism incorporated into a remotely actuated valve that provides for manual closing and locking.
Manufacturing Automation Protocol (MAP
a set of instructions or rules designed to control computer communications and to provide systems status and control in a factory environment.
Manufacturing specialist
an operator/technician capable of operating, maintaining, and repairing multiple manufacturing equipment sets and interfacing with engineers, maintenance, facilities, and systems personnel.
Manufacturing Support Item (MSI)
any supply item used in the cleanroom that indirectly supports the manufacturing process, excluding process fluids, equipment, and the facility (for example, wafer boxes, cleanroom gloves, and wipers). .
Marks, saw
see saw marks.
Mask
1: a flat, transparent plate that contains the photographic image of wafer patterns necessary to define one process layer. 2: a selective barrier to the passage of radiation or matter. Also called etched metal mask or any specific mask type. Contrast photomask.
Mask level
a numbered mask in a sequence that includes device patterns, test patterns, and alignment patterns.
Mask, bimetal
a mask formed by chemically etching openings in a metal film or plate that is protected from the etchant in certain areas by a second metal. The second metal is generally applied to the first by electro-forming or coating.
Mask, etched metal
a mask formed by chemically etched openings in a metal film or plate where it is not protected from the etchant by photoresist or other chemically resistant material.
Mask, metal on glass
an optical mask comprising a glass substrate selectively covered by a thin opaque metal layer; a type of photomask.
Mask, mirror image
a mask having its geometric configuration rotated 180 degrees about a Y-Y axis with respect to an original.
Mask, trimetal
a mask formed by etching a metal protected by a third metal in certain areas.
Masking layer
A patterned layer associated with a semiconductor integrated circuit. A typical circuit will require between 12 and 25 masking layers for full definition.
Masks, device series of
all masks necessary to produce a specific device or circuit.
Mass balance
the identification and quantization of the products of a process or reaction to where all of the expected products are quantitatively accounted for.
Mass Flow Controller (MFC)
a self-contained device (consisting of a transducer, control valve, and control and signal-processing electronics) commonly used in the semiconductor industry to measure and regulate the mass flow of gas.
Mass flow controller calibration pressure, inlet and outlet
in a mass flow controller, the inlet and outlet pressure at which the device was calibrated.
Mass Flow Meter (MFM)
a self-contained device, consisting of a mass flow transducer and signal-processing electronics, commonly used in the semiconductor industry to measure the mass flow of gas.
Mass flow of gas
in mass flow controllers and gas meters, the mass of gas per unit of time flowing in a closed fluid channel. [SEMI Mass Flow Controllers Committee] Also see standard volumetric flow, standard pressure, standard temperature, mass flow controller, and mass flow meter.
Master
in message transfer, the block transfer designation for the equipment (the intelligent system that communicates with a host computer). NOTE-The equipment is designated as the master and the host as the slave; this convention is based upon the assumption that the equipment is less able to store messages than the host.
Master drawing
see composite drawing.
Mastery learning
see criterion-referenced instruction.
Material
in automated material movement, discrete objects that may be transferred to and from equipment. These objects may include product, carriers, reusable fixtures, and so on. Also see transfer object.
Material Control System (MCS)
the software program used to control the routing and transfer of material (wafers, cassettes, or boxes) within an automated material handling system.
Material Hazard Index (MHI)
a numeric value used for ranking chemical production materials to determine the level of controls necessary for regulation. MHI is determined by dividing the equilibrium vapor concentration (EVC) of a material at 25 degrees C by the level of concern (LOC) value for that material.
Material location
in automated material movement, a physical position on a piece of equipment at which a transfer object may reside. Many material locations may be accessed directly through a port, but this is not a requirement. Some material locations internal to the equipment may not be accessible by a transfer agent.
Material on the surface
in flat panel display substrates, small transparent glass particles that are adhered or fused to the glass substrate surface.
Material Safety Data Sheet (MSDS)
1: written or printed material concerning a hazardous material that is prepared in accordance with the provisions of 29 CFR 1910.1200. (See UFC "88" 9.115.) (Form OSHA 20) 2: the descriptive data provided on a data sheet recommended by the Occupational Safety and Health Administration (OSHA) to provide information regarding the hazards of materials to prevent and respond to emergency situations.
Material transport module
a physical unit that moves wafers from place to place within a cluster tool.
Matrix
1: a group of entities that have dissimilar primary functions that interface and cooperate to achieve a common purpose; includes people, machines, and organizations. 2: a two dimensional array of numbers commonly used for vector mathematics.
Matrix management
executive, supervisory, and administrative direction that facilitates the accomplishment of a common purpose by dissimilar groups.
Maximum baking temperature
in a mass flow controller, the highest temperature to which the mass flow controller or its components in contact with the gas can be heated in accordance with a specified baking procedure. The specified baking process will not impair the performance characteristics per the manufacturers specifications.
Maximum focal plane deviation
in the measurement of wafer flatness, the largest of the absolute values of the focal plane deviations (FPD).
Maximum operating pressure
in a mass flow controller, the maximum inlet pressure at which the mass flow controller may be operated. NOTE-Operation is permitted up to this inlet pressure, but performance is not specified above normal operating pressure.
Maximum overrange pressure
in a mass flow controller, the maximum gas pressure to which the mass flow controller (MFC) may be subjected without degrading specified performance. When returned to normal operating pressure, the MFC must require no adjustment to return to specified performance.
Maximum permissible exposure
in safety threshold limit values, the exposure limit for nonionizing radiation, according to ANSI Z136.1 and ANSI C95.1.
Maximum recommended flow
for regulators, a recommended flow rate specified by the manufacturer. This value is typically within the control range of the regulator prior to the drop-off seen in the flow curve.
May
a term indicating that a provision is neither required nor prohibited by a specification.
MCBA
see mean cycles between assists.
MCBF
see mean cycles between failures.
MCC
Microelectronics and Computer Technology Corporation. A cooperative R&D consortium whose mission is to strengthen and sustain the competitiveness of member companies who share common elements of a technical vision in information technology. MCC's membership currently includes 22 shareholders and 38 associate members. Research programs include projects in areas such as software technology, computer-aided design, advanced computing technology, displays, holographic storage, power sources, superconductivity, and distributed information systems.
MCM
see multichip module.
MCS
see material control system.
MCT
MOS Controlled Thyristor. A power device that combines a MOS transistor as the gate and a thyristor as the power source. This composite device has the lowest forward voltage drop of any voltage-controlled power source, including power MOSFETs and IGBTs..
MDL
see minimum detectable limit.
mean
the sum of a group of measurements divided by the number of measurements; the average.
Mean (productive) Time Between Assists (MTBAp)
the average time during which the equipment performed its intended function between assists; productive time divided by the number of assists during that time. (The "p" part of the abbreviation is written with a subscript lowercase letter.)
Mean (productive) Time Between Failures (MTBFp)
the average time during which the equipment performed its intended function between failures; productive time divided by the number of failures during that time (The "p" part of the abbreviation is written with a subscript lowercase letter.)
Mean Cycles Between Assists (MCBA)
the number of equipment cycles between assists; total equipment cycles divided by the number of assists during those cycles.
Mean Cycles Between Failures (MCBF)
the average number of equipment cycles between failures; total equipment cycles divided by the number of failures during those cycles.
Mean focus
in the measurement of photolithographic instruments, the Z-axis position representing the area average focal surface for point-like objects in the optical image.
Mean moving range control chart
see -MR (mean-moving range) control chart.
Mean Time Between Assists (MTBA)
the number of hours producing per week, divided by assists per week; the average number of hours producing until an assist is required. Contrast mean (productive) time between assists.
Mean Time Between Failures (MTBF)
the number of hours producing per week, divided by failures per week; the average number of hours producing until a failure is encountered. Contrast mean (productive) time between failures.
Mean Time Off Line (MTOL)
the average time required to return the equipment to a condition in which it can perform its intended function when downtime is incurred. The sum of all downtime (scheduled and unscheduled) during a specified period, divided by the number of downtime incidents during that period.
Mean Time To Repair (MTTR)
the average time required to correct a failure and to return the equipment to a condition in which it can perform its intended function. The sum of all repair time incurred during a specified period (including equipment and process test time, but not including maintenance delay) divided by the number of failures during that period.
Measured leak rate
the rate of leakage of a given gas distribution system, measured under specified conditions and employing a specified test gas. The measured leak rate shall be corrected to standard leak rate by multiplying by the ratio of 101.3 kPa to the absolute value of the pressurizing helium.
Mechanical characterization
in particle counting, the set of events in which a single wafer or batch of wafers are cycled through the tool so that no intentional process/chemical changes are introduced to the surface or substrate of the wafer; the purpose is to determine particle contributions from the mechanical wafer movement throughout the process tool.
Mechanical leak
in the measurement of mass flow controller leak rates, a leak caused by a physical crack, pit, scratch or other imperfection in a sealing surface, or contamination or debris on the seals.
Mechanical strength
in the manufacture of photolithographic pellicles, the physical condition a pellicle must meet to withstand a specified force from a blow-off gun without suffering any damage to the film due to stretching or breakage.
Median
in a group of measurements arranged from lowest to highest, the middle value if the number of measurements is odd. If the number of measurements is even, the median is the average of the two middle values.
Median surface
of a semiconductor wafer, the locus of points in the wafer equidistant between the front and back surfaces.
Median tolerance limit
designates the concentration of a toxic material at which 50% of the test organisms (usually aquatic organisms) survive.
Medium Scale Integration (MSI)
the placement of between 10 and 100 active devices on a single die.
Mega or M
A prefix meaning a multiple of one million (x106). Symbol: M.
Megabyte (Mbyte)
1,048,576 () bytes, or 1,024 kilobytes of iinformation or storage space.
Megarad
A dose of radiation equal to 106 Rads. Sometimes stated as Megarad(Si) or Megarad(SiO2), indicating the equivalent material absorbing the radiation. See RAD.
Megasonic
a method of cleaning or etching through which the liquid media being employed is mechanically agitated with frequency acoustic energy to improve control or to accelerate the process.
Melting temperature
in semicrystalline polymers, the temperature at which the crystalline phase becomes amorphous.
Membrane probes
integrated circuit test probes that are built on a flexible membrane. The membrane, with the probes, is brought into contact with a wafer through the flexure of the membrane.
Memory
a circuit function that provides capacity for data or information storage.
Memory chip
A chip which retains information for logic chips to use. For example, in a computer, the memory chips will store the word processing program while it is being used, and the letters of the word processing documents which are being worked on. DRAM is the type of memory used most in computers, and is by far the most important type of memory from a total worldwide revenue standpoint. Memory chips tend to have denser transistor layouts and slightly more complicated transistor structures than logic chips. These result in a need for more CVD layers. Memory chip manufacturing thus requires slightly more CVD equipment than logic chip manufacturing.
Memory integrated circuit
An integrated circuit consisting of memory cells and usually including associated circuits such as those for address selection and amplification. A class of integrated circuits that store digital information, the information being expressed in binary numbers. Examples of memory ICs are ROMs, Dynamic and Static RAMs, EPROMs and EEPROMs.
Menu
a list of options visually presented on a terminal by a computer program to allow a user to select a course of action.
Menu-driven
relying heavily on menus and providing the user with total control over the manner in which the program operates. Contrast data-driven.
Mercury arc lamp
The light source that was more or less universally used in photolithographic steppers, up to now. A mercury lamp gives of light which contains a number of bright, well-defined colors, notably the I-line and the G-line which have been widely used in steppers. However, mercury lamps do not have any bright lines suitable for 0.25 micron geometries or below. A mercury lamp can be pushed to handle a 0.25 micron technology with difficulty, but we expect that the critical layers of the 0.25 micron and smaller generation technologies will be the province of steppers based on excimer lasers.
Merge
to combine two ordered arrays in such a manner as to form a third, similarly ordered array. A good example is a list merged with a letter to create personalized letters.
MESFET
MEtal-Semiconductor FET. A type of FET in which the channel is formed directly beneath a metal gate, which itself is in intimate contact with the semiconductor. Compare with MOSFET, where the gate is separated from the semiconductor by a thin insulating oxide layer. Commonly used in III-V materials, such as GaAs, where the gate oxide needed to form a MOSFET is inferior to that in silicon. See channel, GaAs and gate.
Message
a complete unit of communication in one direction. Also see block.
Message fault
in communications and control of semiconductor manufacturing equipment, a condition that occurs when the equipment receives a message that it cannot process because of a defect in the message.
Message header
in SECS-II, information about a message passed by the message transfer protocol. NOTE-The content of the message header consists of device ID, stream and function, reply requested, transaction timeout, and (optionally) multiple open transactions. In SECS-I, the related term "header" refers to the 10-byte header in each block.
Message ID
a 15-bit field in the header; used in the process of message identification. NOTE-The message ID identifies the format and content of the message being sent. The exact message content is equipment-dependent, and a particular message is one of many possible for the particular device.
Message protocol
in message transfer, the SECS-I message protocol uses the services of the block transfer protocol to send and receive messages. (The block transfer protocol is used by a serial line to establish the direction of communication and to provide the environment for the passing of message blocks.) A message consists of the message data, together with the following information from the header in each block: the R-bit, device ID, W-bit, message ID, and system bytes.
Message section
the section of a safety sign that contains those words that clarify the nature and severity of the hazard, so as to provide the rationale for evasive actions. It must also state the appropriate evasive actions. Whenever possible, these messages should be chosen from common usage or community acceptance.
Metal
in cofired ceramic packages, an absence of refractory metallization, braze, or plating material from a designated area greater than 0.075 mm (0.003 in) in diameter.
Metal on glass mask
see mask, metal on glass.
Metal void
see metallization void.
Metallization
1: on ceramic package bases, screen printed metals, such as refractory metals; for example, tungsten. Also see refractory metallization. 2: electrolytic or electroless plated metals; for example, nickel and gold, on base metals such as leadframes, or on top of refractory metallizations. 3: on cerdip or cerpack leadframes, evaporated or clad metals; for example, aluminum. 4: the deposition of a thin film of conductive metal onto a wafer or substrate by use of either chemical or physical vapor deposition (for example, sputtering).
Metallization void
the absence of a clad, evaporated, plated, or screen printed metal layer or braze from a designated area. Also called metal void.
Metal-oxide varistor
See MOV.
Metastasis
the process by which tumor cells are spread to distant parts of the body.
Metering valve
a valve designed to provide varying gas flow rates over a range of settings.
Methane (CH4) equivalent
in testing components for contaminant contribution to gas distribution systems, that concentration of methane that causes the same instrument response as the sample.
Methanol (CH3OH)
a colorless, poisonous, and flammable liquid obtained by the destructive distillation of wood. Also called methyl alcohol or wood alcohol.
Method
in object-oriented programming, a procedure that is associated with a class. A method is invoked in response to a message.
Methods model
in CIM, a model that identifies the methods or allowable operations on classes of objects.
Methods modeling
in CIM, a step of an object-oriented analysis or design technique used to describe the system's work to be performed based on a certain set of operations allowed on classes of objects.
Methyl alcohol
see methanol.
Methyl ethyl ketone (CH3COCH2CH3)
a colorless liquid that is water soluble and can be mixed with oil.
Methylene chloride
see dichloromethane.
Metrics, design
measures for the quality, performance, or productivity of the design process and its component tools.
Metrology
the science of measurement to ascertain dimensions, quantity, or capacity; the techniques and procedures for using sensors and measurement equipment to determine physical and electrical properties in wafer processing.
MFC
see mass flow controller.
MFM
see mass flow meter.
MFR
Manufacturing For Reliability.
MHI
see material hazard index.
Micro
a prefix that means one millionth
Micro
A prefix meaning one-millionth (x10-6). Symbol: µ. Also jargon for microprocessor, microcomputer, microcontroller.
Micro level
in automated material movement, the level of material movement in which the transfer partners interact peer-to-peer to synchronize the detailed mechanical steps of a material transfer.
Microchip
see die.
Microcomputer
(1) A computer system whose processing unit is a microprocessor; (2) A microprocessor, complete with stored program memory--read-only memory (ROM), random-access memory (RAM), and input/output (I/O) logic on a single chip. Microcomputers are capable of performing useful work without additional supporting logic.
Microcontroller
A single-chip microcomputer with on-board program ROM and I/O that can be programmed for various control functions.
Microelectronics Manufacturing Science and Technology (MMST)
a joint development program model sponsored by the U.S. Air Force, the Advanced Research Projects Agency (ARPA), and Texas Instruments to design, develop, and demonstrate next-generation flexible microelectronic fabrication facilities.
Microenvironment
ambient conditions in a very small region.
Microloading
: A potential problem for etch processes. Areas of the circuit where the pattern is dense may etch at a different rate, or in a different way, from places where the pattern is more open. This is partly the result of localized depletion of the reactant species in regions where a lot of material must be removed. Another factor is reactant transport - it is difficult for reactants to find their way down through narrow corridors of resist if the resist features are close together.
Micrometer (m)
a metric unit of linear measure that equals 1/1,000,000 meter ( m), or 10,000 angstroms. The diameter of a human hair is approximately 75 micrometers. Also called micron.
Micromove
in cluster tools, an atomic motion of the end effector described by an ordered pair of position reference points, one of which is the starting point of the motion and the other the end point of the motion.
Micron
See micrometer.
Micropatterning
a category for wafer manufacturing processes that transfers a circuit pattern onto a wafer.
Microprocessor (P)
an integrated circuit that contains the basic arithmetic, logic, and control circuitry required for processing; often consists of one very large-scale integrated circuit.
Microroughness(IIRMS)
1: surface roughness components with spacing between irregularities (spatial wavelength) less than about 100 micrometers. (The "RMS" part of the abbreviation is written with subscript capital letters.)
Microscope
an instrument in which magnifying lenses present an enlarged image of a very small object so that it can be seen by the naked eye.
Microscope field-of-view
that area observed with a particular set of optics.
Microscratch
a scratch that is not visible to the unaided eye under fluorescent (diffuse) illumination but is visible to the unaided eye under incandescent (high intensity) illumination. Contrast macroscratch.
Microsecond (S)
one millionth of a second ( second).
Microtwin
see twinned crystal and pyramid.
Mid-Atlantic Operating Committee
an association of semiconductor industry suppliers located in New York, New Jersey, Pennsylvania, Delaware, Maryland, Ohio, and the District of Colombia that pursues improvements in its members' business quality practices.
Mil
a unit of measure that equals one-thousandth of an inch.
Miller indices
in a crystallographic plane, the smallest integers proportional to the reciprocals of the intercepts of the plane on the three crystal axes of unit length. Also called crystal indices.
Milligauss (mG)
a unit of magnetic flux density equal to one-thousandth of a gauss.
MIMIC
MIcrowave/millimeter wave Monolithic Integrated Circuit. Directed by the U.S. Department of Defense, the MIMIC program was established to enhance producibility and reduce the production cost of gallium arsenide (GaAs) microwave integrated circuits. In this sense, MIMIC is the GaAs microwave industry's equivalent of the VHSIC program. See VHSIC program.
Mine Safety and Health Administration (MSHA)
a federal agency within the U.S. Department of Labor that devises and promulgates mandatory safety and health in mines.
Minienvironment
localized environment created by an enclosure to isolate the product from contamination and people.
Minienvironment input/output
a means of transferring cassettes or substrates into and out of a minienvironment.
Minifactory
small-scale production facility.
Minimum detectable leak rate
see sensitivity.
Minimum Detection Limit (MDL)
in determining total hydrocarbon, moisture, or oxygen contribution by gas distribution system components, the lowest instrument response above zero detectable that is readable by the instrument and at least 2 times the amplitude of the noise.
Minimum feature size
see feature size.
Minimum flat wire bonding area
see lead flat surface.
Minimum pattern
the minimum line and space pattern and minimum pattern that is separable.
Minimum theoretical cycle time
the time required to effect a physical change to a wafer, including loading and unloading time, but not queue or transit time.
Minor flat
see secondary flat.
Minority carrier
a type of charge carrier constituting less than one-half of the total charge -carrier concentration (for example, electrons in p-type material). Contrast majority carrier.
Minority carrier lifetime
of a homogeneous semiconductor, the average time interval between the generation and recombination of minority carriers.
MIPS
Million Instructions Per Second.
Mirror image mask
see mask, mirror image.
Misalignment
a process defect in which a pattern layer does not overlay properly with previous layers.
Miscible
pertaining to the extent to which liquids or gases can be mixed or blended.
Mismatch
in a plastic molded package, the misalignment between the top and bottom cavities in either axis. The misalignment is measured after molding and before trimming and is stated as the difference in the top cavity position relative to the bottom cavity. Also see offset and overlap.
Misstep
see misalignment.
Mixed beds
a physical mixture of anion-exchange material and cation-exchange material. Also see anion-exchange resin and cation-exchange resin.
Mixed signal
an integrated circuit that contains both analog and digital circuit elements.
Mixed signal simulation
A mixed signal simulator simulates the analog portions of the circuit with a very accurate circuit simulator, the digital portions with an efficient event-driven simulator, and the switched capacitor portions with a special-purpose switched capacitor simulator.
ML
See Multilayer TVS.
MLM
see multilevel metal.
MMIC
Monolithic Microwave Integrated Circuit. Combining active elements (diodes and transistors) with passive elements (resistors, capacitors, inductors and transmission lines) on a single GaAs (gallium arsenide) substrate, MMICs replace conventional "chip and wire" microwave circuits. As amplifiers, attenuators or switches at microwave frequencies, MMICs offer benefits of reduced size, lower unit cost, and reliability.
MMST
see Microelectronics Manufacturing Science and Technology.
Mobility
of a carrier in a semiconductor, the ensemble average of drift velocity of a charge carrier per unit electric field. The unit customarily used is square centimeter per volt-second. The preferred SI unit is the square meter per volt-second.
Mode
the most frequently occurring value in a group of measurements.
Model
1: a representation or simulation for device structure, process equipment, or a management system. 2: an abstract, graphical representation of the logical essence of something that allows focusing on characteristics of interest, study, or critical perspectives, views, or aspects to gain understanding and insight into a subject in a manner that is isolated from physical constraints. 3: an explicit description of the data, state, and method information required for each process or application. 4: a set of mathematical or logical relationships that describes how a system behaves or should behave.
Model environment
in CIM, the development models needed to govern an application. The model environment contains the enterprise reference model through member company specific manufacturing model development models and the generic through specific execution services models that govern the application.
Model hierarchy
in CIM, a multilevel set of models used to address the enterprise-, business-, and company-specific problems, applications, and systems relationships.
Modeling
the act or process of generating an abstract description of a system to simplify the analysis of the system. The abstract description must be suitable for use with the appropriate analysis tool.
Modular Dispensing Unit (MDU) a piece of equipment that filters the chemicals and pumps them in precise amounts to the point of use.
Modularity
in CIM, the design of software which partitions the code in (usually small) discrete components with clear interfaces between units and clear partitioning of which units perform which functions.
Module
1: a program unit that is discrete and identifiable with respect to compiling, combining with other units, and loading. For example, the unit may be the input to, or output from, an assembler, compiler, linkage editor, or executive routine. 2: a logically separable part of a program. 3: in modular equipment, an independently operable unit that is part of a tool or system. 4: in the calibration of mass flow devices, the number of moles per unit of time flowing in a closed channel.
Module generation
The automatic construction of major pieces of circuit function by specifying parameters controlling the structure and/or performance of the function. Examples are RAM, ROM, PLA, datapath, state machine, registers, multiplexers, and standard logic families.
Molar flow
in the calibration of mass flow devices, the number of moles per unit of time flowing in a closed channel.
Molding compound
generally, a thermosetting plastic used to encapsulate semiconductor devices by a transfer molding technique. Also see abrasive characteristics, coefficient of thermal expansion, and flash characteristics.
Molding preform
mold compound powder compressed into a cylindrical shape and size with specified diameter, weight, and density.
Molecular migration
the movement or spread of molecules of a substance in an environment, over a surface, across an interface, or through a material due to electrical, thermal, pressure, or concentration gradients, or to random processes.
Molecular Weight (mw)
the sum of the atomic weights of all the atoms in a molecule.
Monitor
a control program for a computer operating system.
Monitor wafer
see wafer, test.
Monocrystal
see single crystal.
Monolithic circuit
Same as integrated circuit. A circuit fabricated within a single body of semiconductor material. This single body of material is referred to as an integrated circuit die. Compare hybrid circuit.
Monolithic system
in CIM, usually large software applications that are designed and coded as a single program, performing all functions and services from within its own structure. These systems are typically complex, difficult to change and maintain, and have tightly coupled database, presentation, and communication services. Changes to any of these require modifications of the source code to be made in many places.
Monte Carlo
refers to random sampling techniques applied in computer simulations and modeling to obtain approximate solutions in problems for which exact solutions do not exist.
Moon crater
on a semiconductor wafer, surface texture that results when a wafer floats during the initial stages of chemical polishing in a rotating cup etcher.
Morphology
the shape and size of a line, an area, or a volume; the texture or topography of a surface; the habit of a crystal; the distribution of phases in a system (material). Form may mean any of these or it may pertain to structure, so it does not have a specific meaning unless given one. [IEEE]
MOS
Metal Oxide Semiconductor. A wafer process for fabricating MOSFET devices in either IC or discrete form. See MOSFET.
MOS transistor
Same as MOSFET.
MOSFET
Metal Oxide Semiconductor Field Effect Transistor. A class of voltage-driven devices that do not require the large input drive currents of bipolar devices. MOSFETs are a type of field-effect transistor that operates and functions similar to a junction field effect transistor. The distinction is that in the MOS device the controlling gate voltage is applied to the channel region across an oxide insulating material, rather than across a P-N junction. The term can be applied either to transistors in an IC or to discrete power devices. The major advantage of a MOSFET is low power due to its insulation from source and drain. Other advantages are its process simplicity, savings in chip real estate, and the ease of interconnection on chip. MOSFETs are of both P-channel and N-channel types. Sometimes called "insulated gate field effect transistor" (IGFET)..
Motif
a graphical user interface "look and feel" standard developed by Hewlett Packard and adopted by the Open Software Foundation.
Motorboat
see comet.
Mottled
pertaining to the existence on a wafer of material in a window that prevents the window from being properly opened.
Mound
on a semiconductor wafer, an irregularly shaped projection on a semiconductor wafer surface with one or more irregularly developed facets. Contrast pyramid. Also see haze.
Mouse nip
a semicircular intrusion into a straight edge of a film or etched pattern on a wafer or reticle. Also called mouse bite.
MOV
Metal-Oxide Varistor. A varistor having a sintered zinc-oxide element and a symmetrical voltage-current characteristic. Such devices provide bi-directional transient suppression capability, enabling them to protect circuits against transient over-voltage occurring from opposite directions. These devices absorb very large amounts of energy--up to 10k joules.
MPU
MicroProcessor Unit. Sometimes used synonymously with microprocessor. See microprocessor and CPU.
MPX
see multiplexer.
MSDS
see material safety data sheet.
MSI
Medium-Scale Integration. A term generally applied to integrated circuit chips containing ten or more gate equivalents, but less than 100. Also applies to memory devices with fewer than 1k (1024) bits of memory. See LSI, SSI, VLSI.
MSPS
Million Samples Per Second. Measurement of time used predominately in referencing data acquisition and DSP.
MTBA
see mean time between assists.
MTBF
see mean time between failures.
MTOL
see mean time off line.
MTTR
see mean time to repair.
Multiblock message
in SECS-I, a message sent in more than one block. NOTE-The first block (consisting of a message header and up to 244 bytes of data) is given a block number of one, and the block number is incremented by one for each subsequent block until the entire message is sent. The blocks are sent in order. For compatibility with SECS-I, those SECS-II messages longer than 244 bytes are multiblock messages. In addition, certain SECS-II messages that otherwise meet the single-block length requirements are allowed to be multiblock messages. Contrast single-block message.
Multi-chip module
A hybrid-type package containing a number of integrated circuits and other components. Used instead of printed circuit boards for applications calling for very high packing densities, high frequencies and high speeds of operation.
Multichip Module (MCM)
a packaging scheme based on interconnecting multiple bare die on a single substrate. Also see multichip package.
Multichip package
a package with a number of integrated circuits and interconnects organized through several layers of conductive patterns. Each integrated circuit is separated by an insulator layer and interconnected via holes.
Multilayer TVS
Multilayer Transient Voltage Suppressor. A type of varistor composed of alternating layers of semiconducting ceramic and electrode material. This combination forms a "stack" that greatly enhances the available cross-sectional area and hence the device current handling capability.
Multilevel Metal (MLM)
that portion of the manufacturing process of integrated circuits that involves the deposition, patterning, planarization, and dielectric isolation of two or more levels of metal interconnects.
Multiplexer (MPX)
a device for combining two or more signals.
Multiplexer (mux)
A device that combines several input signals into a single output signal in such a manner that each of the input signals subsequently can be recovered.
Multiplexing
A process of transmitting more than one signal over a single link, route, or channel. Of the two methods in use, parallel processing frequency-shares the bandwidth of a channel in the same way hurdlers run and jump in their assigned lanes, thus permitting a number of contestants to compete simultaneously on the same track. The second method, called serial processing, time-shares multiple signals in the same way that pole vaulters vault over the same bar one after the other. Although serial processing may not seem simultaneous, the signal speed is so fast that it is possible to multiplex four different numbers through a single decoder-driver and have them appear on four different displays without a flicker.
Multiplexing
the simultaneous transmission of more than one message on a single channel.
Multiplier
A circuit whose output state is the arithmetic product of two input signals. Important in DSP (digital signal processing) technology for signal processing and power control applications.
Mutagen
a chemical or physical agent that induces genetic mutations in the DNA of chromosomes.
Mux
MUltipleXer.
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