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R&R
Repeatability and Reproducibility
R(on)
on-Resistance. The output resistance of a power switching device when it is forward biased to the fully "on" or conducting state. Especially important in high-current switches, where the voltage drop across the power device must be minimized. In a power MOSFET, R(on) is the same as RDS(on). See RDS(on).
Race condition
The situation arising when inputs to a gate traverse parallel, but different, circuit paths. Differing path delays can result in unpredictable signal arrival times at a gate, and uncertain transition time for the output of the gate
Rad
Specifies the amount of energy transferred to a material by ionizing radiation. One rad is equal to the energy of 100 ergs per gram of material. The material must be specified, because the energy differs with each material. 1 rad-Si=100 ergs/grams of silicon.
Rad-hard
RADiation HARDened. See radiation hardened circuit.
Rad-hard: strategic
Terminology used to describe products or programs that must be capable of surviving and operating in very high levels of radiation, including high total dose, high dose rate, and SEU (single-event-upset) environments. Circuits requiring in excess of 1000k rads-Si are considered strategic rad hard. See SEU.
Rad-hard: tactical
Terminology used to describe products or programs that must be capable of surviving and operating in medium levels of radiation, usually total-dose environments. Circuits requiring up to 50k rads-Si are considered tactical rad hard.
Radial cluster tool
a cluster tool in which all wafer transport axes intersect at a common point within the transport module.
Radiation hardened circuit
Integrated circuit that has been manufactured with special devices and isolation techniques such that when exposed to heavy radiation it remains operational. Conventional circuits will short out under such conditions because the radiation generates electrical currents inside the semiconductor material.
Radical
a chemical fragment of a larger molecule.
Radio Frequency (RF)
electromagnetic energy with frequencies ranging from 3 kHz to 300 GHz. Microwaves are a portion of radio frequency extending from 300 MHz to 300 GHz.
Radiometer
an instrument for measuring the intensity of radiant energy.
RAM
Random-Access Memory. A memory that may be written to, or read from any address location in any sequence. Also called a read/write memory. Random access in the sense of providing access to any storage location in the memory. Stores digital bits temporarily and can be rapidly changed as required. RAM constitutes the basic read/write storage element in computers. See DRAM and SRAM.
Ram follower
a transducer device used to measure the linear movement or velocity of a mold press transfer ram. Using this device, the flow characteristics of a molding compound may be measured. In particular, the gel time may be measured. Also see spiral flow.
Ramp-down
the portion of a maintenance procedure required to prepare the equipment for hands-on work. It includes purging, cool-down, warm-up, etc. Ramp-down is included only in scheduled and unscheduled downtime. Also see equipment downtime.
Ramp-up
the portion of a maintenance procedure required, after the hands-on work is completed, to return the equipment to a condition in which it can perform its intended function. It includes pumpdown, warm-up, stabilization periods, initialization routines, etc. It does not include equipment or process test time. Ramp-up is included only in scheduled and unscheduled downtime. Also see equipment downtime.
Random Access Memory (RAM)
data storage that can be read from, and written to, arbitrary locations in arbitrary sequence.
Random logic device
a semiconductor device that contains an interconnected array of dissimilar function blocks, such as memory, registers, arithmetic logic unit, and bus interface unit. Examples are the microcomputer and the microprocessor.
Range
the region between the limits within which a quantity is measured, expressed by stating the lower and upper range values.
Rapid Thermal Annealing (RTA)
see rapid thermal processing.
Rapid Thermal Processing (RTP)
a process in which a wafer is heated to a specified temperature for short periods of time. When referring specifically to annealing processes, the process is called rapid thermal annealing (RTA).
Rare gas
any of the six gases, all noble, comprising the extreme right-hand group of the Periodic Table; namely helium, neon, argon, krypton, xenon, and radon.
Raster
the movement or area defined by repetitively scanning (with a microscope) in the X-direction while moving stepwise in the Y-direction.
Rated pressure
the manufacturer's recommended maximum allowable operating pressure at the manufacturer's rated temperature.
Rated pressure
the manufacturer's recommended maximum allowable operating pressure at the manufacturer's rated temperature.
Rated pressure
the manufacturer's recommended maximum allowable operating pressure at the manufacturer's rated temperature.
RDS(on)
The resistance between drain and source of a forward-biased power MOSFET at a specified drain current and gate voltage.
Reach
the distance measured from the interface plane to the wafer centroid (center of mass) within a process module or a cassette module of a cluster tool.
Reactive Ion Etch (RIE)
a dry-etch process using electrical discharge to ionize and induce ion bombardment of the wafer surface to obtain the required etch properties.
Reactivity
the tendency of a substance to undergo chemical reaction, either by itself or with other materials, and to release energy.
Reactor
a sealed isolation chamber in which a reaction occurs.
Ready to Receive
see EOT.
Reagent
in the semiconductor industry, a chemical that is suitable for use in the manufacture of semiconductors or in the performance of chemical tests. The purity of a reagent solution is higher than the purity of a standard solution.
Real time
pertaining to a system designed to control a dynamic process within the timing constraints of the process.
Real-time operation
Data processing technique in which information is utilized as events occur and the information is generated, as opposed to batch processing at a time unrelated to the time the information was generated.
Receiver
the end of the SECS-I link receiving a message.
Receiving port
in an automated material transfer, the port into which a transfer object is to be placed.
Recipe
the computer program, rules, specifications, operations, and procedures performed each time to produce a wafer that contains functional die. Examples are the setup recipe and the process recipe.
Reclaim test wafer
see wafer, reclaim test.
Rectifier
A device that converts alternating current into direct current. See diode.
Reduction stepper
A photolithography machine that reduces the image which is projected onto the wafer. A typical reduction factor is 5x, which makes life earlier for the reticle makers since they can make the features on the reticles five times larger than what is needed on the circuit. Reduction optics is more complicated though and so reduction steppers are more expensive than 1x (non-reduction) steppers. However, the most advanced steppers for the leading edge technologies are usually reduction steppers.
Redundancy
Memory chips are often designed with additional memory elements, called redundant elements. If the chip is nearly but not quite perfect because a few of its memory elements do not work, it can be repaired by disconnecting the bad memory elements and connecting the good redundant ones. Both the disconnection and connection are accomplished by cutting fuses made of polysilicon or metal in the circuit by using a laser.
Reference ambient
in a mass flow controller, the composition and pressure range of the ambient medium surrounding the device within which performance specifications apply without requiring correction for changes in the ambient medium.
Reference operating pressure, inlet and outlet
in a mass flow controller, the range of gas pressures on the inlet of the device and across the device within which performance specifications apply without requiring correction for gas pressure effects.
Reference operating temperature
in the temperature specifications of mass flow controllers, the range within which accuracy statements apply without requiring correction for temperature effects.
Reference plane
in semiconductor technology, a plane defined by one of the following: three points at specified locations on the front surface of a wafer; the least squares fit to the front surface of a wafer using all points within the fixed quality area (FQA); the least squares fit to the front surface of a wafer using all points within a site; or an ideal back surface (equivalent to the ideally flat chuck surface that contacts the wafer).
Referent
the message intended to be associated with the symbol.
Reflectometer
equipment used to measure the reflectance or cloudiness of a metal.
Reflectometry
a technique for measuring reflectance or the reflectance factor.
Refractive index
the ratio of the velocity of light in the first of two media to its velocity in the second as it passes from one into the other. The first medium is usually a vacuum.
Refractory metallization
a high melting point metal, usually tungsten or a mixture of similar metals in paste form, which is screen printed onto unfired ceramic sheets (green sheets) in order to produce metallized areas in cofired ceramic packages.
Regenerant
in the ionic contamination testing of semiconductor leadframes, a chemical solution containing the ions originally present in the chromatograph column prior to a test run, used to prepare the column for a new test.
Register Transfer Level (RTL)
a circuit description that involves describing the circuit in terms of storage registers and sequence of transfers of data between the registers.
registration
1: the accuracy of the relative position of all functional patterns on any reticle with the corresponding patterns of any other reticle of a given device series when the reticles are properly superimposed. 2: a vector quantity defined at every point on the wafer. It is the difference, R, between the vector position, of a substrate geometry and the vector position of the corresponding point, in a reference grid. 3: in the overlay capabilities of wafer steppers, a vector quantity defined at every point on the wafer. It is the difference, R, between the vector position, of a substrate geometry, and the vector position of the corresponding point, in a reference grid.
registration holes
holes in the bottom of the box door that fit over registration pins in the top of the port door when the box is placed on the port door.
registration pins
pins that provide fixed position and orientation between the port door and box door and assist in final positioning of the box on the port assembly. The registration pins fit into the registration holes in the bottom of the box door.
regulated material, other
see other regulated material.
regulator a valve designed to reduce a high incoming pressure (for example, from a cylinder) to a lower outlet pressure by automatically opening to allow flow until a desired, preset pressure on the outlet side is reached and then automatically throttling closed to stop further pressure increase.
regulator
isolation valve a valve located between a purge manifold and a system regulator to separate, when closed, the regulator from the purging process, thereby maintaining the undiluted purity of the gas in the regulator.
relative humidity (RH)
the quantity of water vapor present in the atmosphere as a percentage of the quantity that would saturate at the existing temperature.
relative minimum
in optics, a minimum in the amount of light transmitted through a polarizer and analyzer combination that results when either the polarizing angle or the analyzing angle is varied (with the other angle fixed).
reliability
of equipment, the probability that the equipment will perform its intended function, within stated conditions, for a specified period of time.
relief valve
a pressure-relieving device, installed in a line or control component, designed and adjusted to release pressure that could damage other components in the system.
Reply
the particular second message of a transaction sent in response to the first message of the same transaction. NOTE-The reply is the secondary message; the first message is the primary message. Contrast primary message.
Reply linking
the process of forming a transaction from a primary message and a secondary message. NOTE-A primary message is the first message of a transaction, and a secondary message is the second.
Reportable Quantity (RQ)
the quantity of material that, when spilled, must be reported to the appropriate authority.
Repository
1: a database system with services for storing all types of data objects such as documents, CASE diagrams, and interrelationships between such objects, allowing a user to locate, check out, display, edit, and check in these objects. A repository maintains the consistency of these objects according to user-defined rules during concurrent access and manipulation. 2: a system for storing and accessing information. 3: a data service that provides a mechanism for the consistent and shared use of data among a set of applications. It is an important means by which the applications can be properly integrated. The set of applications will be broadened over time. 4: the database containing the complete set of information including the models describing the system, the processes, and the environments in which it is produced and in which it will operate. Repository data and information is accessible to users through more than one interface and through more than one level of abstraction.
Request For Information (RFI)
documentation from contractor to the design team to request clarification.
Request to Send
see ENQ.
Residue
any undesirable material that remains on a substrate after any process step.
Residue, solvent
see solvent residue.
Residue, wax
see wax residue.
Resin bleed
the seepage of the resin component of plastic molding compounds between the face of a plastic package encapsulation mold and the leadframe surface in contact with the mold. This resin may affect the soldering or plating of the leadframe unless it is removed by chemical or media deflashing. Contrast flash.
Resist
a photosensitive liquid-plastic film applied to the surface of a wafer for lithography. Also see photoresist.
Resist breakdown
describes the excessive removal of metal that occurs when and if the resists used to mask metal in the production of etched leadframes flake off during the etching process. This excess removal is in addition to the undercut normally observed. Also see etch factor, leadframe, and undercut.
Resist cure
the process of eliminating undesirable properties of resists. Such properties include tackiness, softness, a tendency to flow, and lack of adhesion.
Resist edge adhesion
see adhesion, resist edge.
Resist lifting
on a wafer, the loss of adhesion of a resist coating to its substrate. Also called photo lifting.
Resist rings
on a wafer, buildup of a resist in round, multicolored rings; generated by particles or bubble bursts.
Resist track
Sometimes called a track. A common name for a photoresist spin coater. See spin coater. The term "track" comes from the early designs in which wafers were transported to and from the spin stations on parallel rails called tracks. These days the more advanced spin coaters use robotic arms for movement of the wafers.
Resistance, chemical
the ability of a material, such as a resist coating, to withstand chemical attack.
Resistivity
1: of a semiconductor, the ratio of the potential gradient parallel with the current in the material to the current density. Units are . 2: the resistance that a unit volume of semiconductor material offers to the passage of electricity when the electric current is perpendicular to two parallel faces. 3 n (electrical) : the measure of difficulty with which charge carriers flow through a material. Resistivity is the reciprocal of conductivity. DISCUSSION-The resistivity of a semiconductor or other material is the ratio of the potential gradient (electronic field) parallel with the current to the current density.
Resistivity gradient
see radial resistivity variation.
Resolution
the fineness of detail revealed by an optical device. Resolution is usually specified as the minimum distance by which two lines in the object must be separated before they can be revealed as separate lines in the image.
Resolution dagger
a photolithography tool used to enhance and refine resolution.
Resolution, practical
the minimum linewidth that reproduces the mask (or drafting) dimensions faithfully.
Resolution, usable
the smallest image that can be produced and subsequently processed in a given thickness of resist coating.
Resonance
in testing regulator performance characteristics, diaphragm oscillation when the regulator is used under normal conditions.
Response curve
relation between the measured scattered light intensity and latex sphere diameter. This curve depends on the used light source and may have nonmonotonic regions.
Response time
in testing components for contaminant contribution to gas distribution systems, the time required for the system to reach steady state after a measurable change in concentration.
Retention time
in the ionic contamination testing of semiconductor leadframes, the time required for a particular ion type to pass from the injection port to the detector. Retention time is characteristically different for each ion type.
Reticle
a very flat glass plate that contains the patterns to be reproduced on a wafer; the image may be equal to or larger than the final projected image. Typical reticle substrate material is quartz, and typical magnifications are 10, 5, and 1 times final size. The reticle is used in a stepper.
Reticle eyepiece
a microscope eyepiece that has as its focal plane a system of lines or other reference marks.
Retrofit
1: the modification of a building to incorporate new functions not included in the original building design. 2:the modification of equipment to incorporate changes and improvements in technology as they become available.
Retry count
in the block transfer protocol, the number of unsuccessful attempts to send a block. Also see RTY.
Retry count
in the block transfer protocol, the number of unsuccessful attempts to send a block. Also see RTY.
Return On Investment (ROI)
a SEMATECH calculation of derived member company benefits divided by their costs to obtain those benefits.
Return to zero
a digital waveform that undergoes two transitions per clock cycle. Also see non-return to zero.
Reverse Osmosis (RO)
a technique used in desalination treatment. Pressure is applied to the saline solution, forcing pure water to pass from the solution through a membrane that will not pass the undesired ions.
Reverse polarity mask
see photomask, reverse polarity.
RHD1
An advanced wafer process that will support high-speed 256k rad-hard SRAMS. The process features 0.8µm feature size and SIMOX substrates..
RIE
see reactive ion etch.
RISC
Reduced Instruction Set Computer (or Chip). A type of processor architecture that processes programs more quickly than conventional microprocessors because it uses a smaller, less complex set of instructions. Compare CISC.
Risk
an expression of the possibility of a mishap in terms of hazard severity and hazard probability.
Roadmap
comprehensive forecast in which requirements and actions are described in a time sequence.
Robot vehicle
a piece of equipment having a cassette transfer robot on the vehicle, which moves to another piece of equipment and transfers cassettes.
ROI
see return on investment.
Roll back
a procedure used in file systems and database management systems to restore integrity after an incident. Data changes are made in a nonpermanent way until a complete logical transaction is completed. The changes are then committed; that is, made permanent as a group. If there is a problem, all changes in the logical transaction are deleted; that is, rolled back.
ROM
Read-Only Memory. A memory in which the binary information located at each address is fixed and cannot be changed subsequently. Permanently stores information repeatedly used, such as tables of data, characters for electronic displays, etc. In its virgin state, the ROM consists of a mosaic of undifferentiated cells. One type of ROM is programmed by mask pattern as part of the last fabrication stage. Another popular type known as PROM, is programmable in the field with the aid of programmer equipment. Programmed data stored in ROMs are often called firmware. Compare EPROM.
Rotary concentrator
equipment that uses a rotating wheel containing zeolite to absorb volatile organic carbon (VOC) emissions from wafer fabrication equipment. The VOCs are are then desorbed by heat and subsequently burned.
Rotated astigmatism
in the measurement of photolithographic instruments, at each image site, the Z-axis difference for the line focus of two evaluative line sets, oriented at right angles to each other and at some specified angle to the coordinate system, where the specified angle is selected so that the Z-axis focus difference is a maximum at the given image site. The specified angle may vary from image site to image site.
Rotation
in dielectrically isolated (DI) wafers, the angle of deviation between the primary flat of the DI wafer and the X axis of the photolithography pattern.
Rotational error
the error that occurs when functional patterns are misaligned by some angle to the X-X and Y-Y axes during step and repeat.
Roughness
1: the more narrowly spaced components of surface texture. DISCUSSION-These components are considered within defined limits of spatial wavelength (or frequency). 2: in flat panel display substrates, the criterion for the smoothness of the sheet surface.
Roughness average
in surface profilometry, the arithmetic average of the absolute values of the measure profile height deviations taken within the sampling length and measured from the graphical center line.
Routing
the act of connecting all of the nets in an integrated circuit to the ports of the logic elements. Also, the interconnections of the components on a board.
Row
the set of functional patterns that lies along an X-X axis of a photomask.
RTA or RTP
see rapid thermal processing.
RTL
see register transfer level.
RTX
Real-Time EXpress. A specialized 16-bit microcontroller for custom, real-time embedded data processing applications, primarily military. See microcontroller.
RTY
the retry limit (RTY), or the maximum number of times that the block transfer protocol will retry sending a block before declaring a failed send. Also see retry count.
Rub
in flat panel display substrates, a surface scratch or series of small scratches, generally caused during handling.
Rugged, ruggedized
A term associated with MOSFETs or IGBTs that are designed, manufactured and tested to an avalanche energy specification. Also refers to electronic systems or devices that have been strengthened or modified for better resistance to wear, stress and abuse--for example, in space or under battlefield conditions or conditions of severe weather or dirt. See radiation hardened circuit.
Rundown
on a semiconductor package, the linear distance from the upper surface of a ceramic cavity layer to the bottom point of the overhang into the cavity, of a sealing glass or metallization layer that has been screened onto that surface.
Runout
see cumulative pitch error.
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