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Professional articles
In brackets you will find some additional information about the articles: (author/s, publication, date of issue).
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300mm Fab Conversions & Chemispherical Challenge - a Modell Case Study (K. Kümmerle und P. Csatary, Semiconductor Fabtech, 17th Edition, Sept. 2002).pdf |
927 KB |
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A fresh look at MEMS-MST Production Facilities (J. Fröhlig und P. Ramsell, mst news, Feb. 2004).pdf |
579 KB |
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A life-cycle cost (LCC) fab model-interaction between activities in IC manufacturing and their supporting facilities within a fab (W. Riedel, C. Braun, IMEC, Semiconductor Fabtech, Jul. 2004).pdf |
1.4 MB |
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Advances in Airborne Molecular Contamination in 300 mm Process Technology (K. Kümmerle, 2002).pdf |
63 KB |
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Application of Virtual Reality and Modelling in the Design and Construction of Semiconductor Wafer Fabs (H. Schneider, P. Csatary, S. Berner, Virtual Reality - Selected Issues and Appl., July 2000).pdf |
645 KB |
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Efficient cleaning - M+W Zander develops a new exhaust gas cleaning system (R. Fernandes, Siemens advance, Feb. 2003).pdf |
239 KB |
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Greater collaboration provides new integrated solutions (H. Gath, Cleanrooms, Edition May 2005).pdf |
466 KB |
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Purification of Solvent-carrying exhaust air in the semiconductor industry with the M+W Zander biotrickling system (C. Bogenrieder, wlb - Wasser Luft Boden, Oct. 2001).pdf |
230 KB |
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Reducing costs with the farmed fab layout (D. Yeaman und D. Martin, Semiconductor Equipment and Materials International, 2002).pdf |
84 KB |
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Successful reconstruction of tank farm control system - Prozess Support with Wago Ethernet Controller (Th. Theuring, 2003).pdf |
72 KB |
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